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5962F9666302VXC

Part # 5962F9666302VXC
Description Quad Transmitter RS-422 16-Pin CFPAK
Category IC
Availability Out of Stock
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

1
®
FN4898.2
HS-26CLV31RH
Radiation Hardened 3.3V Quad Differential
Line Driver
The Intersil HS-26CLV31RH is a radiation hardened 3.3V
quad differential line driver designed for digital data
transmission over balanced lines, in low voltage, RS-422
protocol applications. CMOS processing assures low power
consumption, high speed, and reliable operation in the most
severe radiation environments.
The HS-26CLV31RH accepts CMOS level inputs and converts
them to differential outputs. Enable pins allow several devices
to be connected to the same data source and addressed
independently. The device has unique outputs that become
high impedance when the driver is disabled or powered-down,
maintaining signal integrity in multi-driver applications.
Specifications
Specifications for Rad Hard QML devices are controlled by
the Defense Supply Center in Columbus (DSCC). The SMD
numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-96663. A “hot-link” is provided
on our homepage for downloading.
www.intersil.com/military/
Features
Electrically Screened to SMD # 5962-96663
QML Qualified per MIL-PRF-38535 Requirements
1.2 Micron Radiation Hardened CMOS
- Total Dose. . . . . . . . . . . . . . . . . . . . . 300 krad(Si)(Max)
- Single Event Upset LET . . . . . . . . . . .100MeV/mg/cm
2
)
- Single Event Latch-up Immune
Extremely Low Stand-by Current . . . . . . . . . .100µA (Max)
Operating Supply Range . . . . . . . . . . . . . . . . 3.0V to 3.6V
CMOS Level Inputs . . .V
IH
> (0.7)(V
DD
); V
IL
< (0.3)(V
DD
)
Differential Outputs. . . . . . . . . . . V
OH
> 1.8V; V
OL
< 0.5V
High Impedance Outputs when Disabled or Powered
Down
Low Output Impedance . . . . . . . . . . . . . . . . . 10Ω or Less
Full -55°C to +125°C Military Temperature Range
Pb-Free (RoHS Compliant)
Applications
Line Transmitter for MIL-STD-1553 Serial Data Bus
Ordering Information
ORDERING NUMBER
(Note)
INTERNAL
MKT. NUMBER PART MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
5962F9666302QEC HS1-26CLV31RH-8 Q 5962F96 66302QEC -55 to +125 16 LD SBDIP D16.3
5962F9666302QXC HS9-26CLV31RH-8 Q 5962F96 66302QXC -55 to +125 16 LD FLATPACK K16.A
5962F9666302VEC HS1-26CLV31RH-Q Q 5962F96 66302VEC -55 to +125 16 LD SBDIP D16.3
5962F9666302VXC HS9-26CLV31RH-Q Q 5962F96 66302VXC -55 to +125 16 LD FLATPACK K16.A
HS1-26CLV31RH/PROTO HS1-26CLV31RH/PROTO HS1- 26CLV31RH /PROTO -55 to +125 16 LD SBDIP D16.3
HS9-26CLV31RH/PROTO HS9-26CLV31RH/PROTO HS9- 26CLV31RH /PROTO -55 to +125 16 LD FLATPACK K16.A
NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible
with both SnPb and Pb-free soldering operations.
Data Sheet May 28, 2009
[ /Title
(HS-
26C31
RH)
/Subje
ct
(Radia
tion
Harde
ned
Quad
Differe
ntial
Line
Driver)
/Autho
r ()
/Keyw
ords
(Inters
il
Corpo
ration,
semic
onduc
tor,
Radiat
ion
Harde
ned,
RH,
Rad
Hard,
QML,
Satellit
e,
SMD,
Class
V,
Data
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2000, 2008, 2009. All Rights Reserved
Satellite Applications Flow (SAF) is a trademark of Intersil Corporation. All other trademarks mentioned are the property of their
2
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4898.2
May 28, 2009
Pinouts
HS1-26CLV31RH
(16 LD SBDIP)
CDIP2-T16
TOP VIEW
HS9-26CLV31RH
(16 LD FLATPACK)
CDFP4-F16
TOP VIEW
Logic Diagram
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
AIN
AO
AO
ENABLE
BO
BO
GND
BIN
VDD
DO
DO
ENABLE
CO
CO
CIN
DIN
AIN
AO
AO
ENABLE
BO
BO
BIN
GND
2
3
4
5
6
7
8
116
15
14
13
12
11
10
9
VDD
DIN
DO
DO
ENABLE
CO
CO
CIN
ENABLE ENABLE
AIN
AO
BIN
BO
CIN
CO
DIN
DO DO CO BO AO
HS-26CLV31RH
3
FN4898.2
May 28, 2009
Die Characteristics
DIE DIMENSIONS:
96.5 mil x 195 mils x 21 mils
(2450 x 4950)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 8kÅ ±1kÅ
Metallization:
Bottom: Mo/TiW
Thickness: 5800Å ±1kÅ
Top: AlSiCu (Top)
Thickness: 10k
Å ±1kÅ
Substrate:
AVLSI1RA
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
V
DD
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2.0 x 10
5
A/cm
2
Bond Pad Size:
110µm x 100µm
Metallization Mask Layout
HS-26CLV31RH
(14) DO
(13) DO
(12) ENABLE
(11) CO
(10) CO
AO (2)
AO
(3)
ENABLE (4)
BO
(5)
BO (6)
BIN (7)
GND (8)
CIN (9)
GND (8)
(1) AIN
(16) VDD
(15) DIN
(16) VDD
TABLE 1. HS26CLV31RH PAD COORDINATES
RELATIVE TO PIN 1
PIN
NUMBER
PAD
NAME
X
COORDINATES
Y
COORDINATES
1AIN 0 0
2 A0 0 -570.7
3A0
0 -1483.5
4 ENABLE 0 -2124.8
5B0
0 -2873.5
6 B0 0 -3786.3
7 BIN 0 -4357
8 GND 852.4 -4357
8 GND 1062.4 -4357
9 CIN 1912.8 -4357
10 C0
1912.8 -3786.3
11 C0 1912.8 -2873.5
12 ENABLE
1912.8 -2124.8
13 D0
1912.8 -1483.5
14 D0 1912.8 -570.7
15 DIN 1912.8 0
16 VIN 1062.4 0
16 VIN 852.4 0
NOTE: Dimensions in microns
HS-26CLV31RH