2
Specifications HS-3374RH
Absolute Maximum Ratings Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+11.0V
I/O Voltage Applied. . . . . . . . . . . . . . . . . . . GND-0.3V to VDD+0.3V
Storage Temperature Range . . . . . . . . . . . . . . . . . -65
o
C to +150
o
C
Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175
o
C
Lead Temperature (Soldering 10s). . . . . . . . . . . . . . . . . . . . +300
o
C
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Resistance (Typical) θ
JA
(
o
C/W) θ
JC
(
o
C/W)
SBDIP Package. . . . . . . . . . . . . . . . . . 74.8 12.3
Maximum Package Power Dissipation at +125
o
C
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.67W
If Device Power Exceeds Package Dissipation Capability, Provide
Heat Sinking or Derate Linearly at the Following Rate:
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.4mW/
o
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Conditions
Operating Voltage Range VDD . . . . . . . . . . . . . +9.5V to +10.5V
VCC . . . . . . . . . . . . +4.75V to +5.25V
Operating Temperature Range. . . . . . . . . . . . . . . . -55
o
C to +125
o
C
Input Voltage Range
Data Inputs (CMOS) . . . . . . . . . . . . . . . . . . .GND-0.3 to VDD+0.3
Data Inputs (TTL) . . . . . . . . . . . . . . . . . . . . .GND-0.3 to VCC+0.3
Enable, Disable Inputs . . . . . . . . . . . . . . . . .GND-0.3 to VDD+0.3
Input Low Voltage (CMOS) . . . . . . . . . . . . . . . . . . . . . . . GND to 1V
Input High Voltage (CMOS). . . . . . . . . . . . . . . . . .VDD-1.0V to VDD
Input Low Voltage (TTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V
Input High Voltage (TTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.8V
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS
GROUP A
SUBGROUPS TEMPERATURE
LIMITS
UNITSMIN MAX
ENABLE AND DISABLE IINPUTS
Input Leakage Current IIH CMOS VDD = 10.5V, VCC = 5.25V,
VIN = 10.5V, Floating Outputs
1, 2, 3 -55
o
C, +25
o
C,
+125
o
C
-1µA
TTL INPUT TO CMOS OUTPUTS
Input Leakage Current IIL IIH VDD = 10.5V, VCC = 5.25V,
VIN = 0.8V, Other Inputs at 2.8V
1, 2, 3 -55
o
C, +25
o
C,
+125
o
C
-1 - µA
VDD = 10.5V, VCC = 5.25V,
VIN = 2.8V, other Inputs = 0.8V
1, 2, 3 -55
o
C, +25
o
C,
+125
o
C
-1µA
High Level Output
Voltage
VOH VDD = 9.5V, VCC = 4.75V,
VIH = 2.8V, VIL = 0.8V,
IOH = -2.0mA
1, 2, 3 -55
o
C, +25
o
C,
+125
o
C
9- V
Low level output
Voltage
VOL VDD = 10.5V, VCC = 5.25V,
VIH = 2.8V, VIL 0.8V,
IOL = 2.0mA
1, 2, 3 -55
o
C, +25
o
C,
+125
o
C
- 0.5 V
CMOS to TTL OUTPUTS
High Level Output
Voltage
VOH VDD = 9.5, VCC = 4.75V,
VIH = 8.5V, VIL = 1.0V,
IOH = -2.0mA
1, 2, 3 -55
o
C, +25
o
C,
+125
o
C
3- V
Low Level Output
Voltage
VOL VDD = 10.5V, VCC = 5.25V,
VIH = 9.5V, VIL = 1.0V,
IOL = 11mA
1, 2, 3 -55
o
C, +25
o
C,
+125
o
C
- 0.4 V
Output Leakage
Current
IOZL VDD = 10.5V, VCC = 5.25V,
VIN = 0V, All other pins high
1, 2, 3 -55
o
C, +25
o
C,
+125
o
C
-10 - µA
IOZH VDD = 10.5V, VCC = 5.25V,
VIN = 2.8V, All other pins at
GND
1, 2, 3 -55
o
C, +25
o
C,
+125
o
C
-10µA
Spec Number 518052