STANDARD
SIZE
A
5962-95630
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
N
SHEET
3
DSCC FORM 2234
APR 97
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class Device requirements documentation
Q, V Certification and qualification to MIL-PRF-38535
T Certification and qualification to MIL-PRF-38535 with performance as specified
in the device manufacturers approved quality management plan.
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
X CDIP2-T28 28 Dual-in-line
Y CDFP3-F28 28 Flat pack
Z CDFP3-F28 28 Flat pack with grounded lid
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q, T and V.
1.3 Absolute maximum ratings. 1/
Supply voltage between V+ and V- :
Device type 01 ......................................................................................... +40 V
Device types 02, 03, 04, and 05 .............................................................. +33 V
Supply voltage between V+ and GND :
Device type 01 ......................................................................................... +20 V
Device types 02, 03, 04, and 05 .............................................................. +16.5 V
Supply voltage between V- and GND :
Device type 01 ......................................................................................... -20 V
Device types 02, 03, 04, and 05 .............................................................. -16.5 V
V
REF
to GND :
Device type 01 ......................................................................................... +20 V
Device types 02, 03, 04, and 05 ............................................................. +16.5 V
Digital input overvoltage range .................................................................... ((GND) - 4 V) ≤ V
A
≤ ((V
REF
) + 4 V)
Analog input overvoltage range (power on/off):
Device type 01 ......................................................................................... -25 V ≤ V
S
≤ +25 V
Device types 02, 03, 04, and 05 .............................................................. -35 V ≤ V
S
≤ +35 V
Storage temperature range .......................................................................... -65°C to +150°C
Junction temperature (T
J
) ............................................................................ +175°C
Maximum package power dissipation (P
D
): 2/
Case X ................................................................................................... 1600 mW
Cases Y and Z ......................................................................................... 1400 mW
Lead temperature (soldering, 10 seconds) .................................................. +275°C
Thermal resistance, junction-to-case (θ
JC
) .................................................. See MIL-STD-1835
Thermal resistance, junction-to-ambient (θ
JA
):
Case X ................................................................................................... 83.1°C/W
Cases Y and Z ......................................................................................... 49.1°C/W
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The derating factor for case X shall be 20.4 mW/°C, above T
A
= +95°C, and for cases Y and Z shall be 18.5 mW/°C
above T
A
= +95°C.
