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5962F9563201VXC

Part # 5962F9563201VXC
Description Quad Transmitter RS-42216-Pin CFPAK
Category IC
Availability In Stock
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INTEL
Date Code: 0505
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

1
®
FN2929.3
HS-26CT31RH
Radiation Hardened Quad Differential Line
Driver
The Intersil HS-26CT31RH is a quad differential line driver
designed for digital data transmission over balanced lines
and meets the requirements of EIA standard RS-422.
Radiation hardened CMOS processing assures low power
consumption, high speed, and reliable operation in the most
severe radiation environments.
The HS-26CT31RH accepts TTL signal levels and converts
them to RS-422 compatible outputs. This circuit uses special
outputs that enable the drivers to power down without
loading down the bus. Enable and disable pins allow several
devices to be connected to the same data source and
addressed independently.
Specifications
Specifications for Rad Hard QML devices are controlled by
the Defense Supply Center in Columbus (DSCC). The SMD
numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-95632. A “hot-link” is provided
on our homepage for downloading.
www.intersil.com/military/
Features
Electronically Screened to SMD #5962-95632
QML Qualified Per MIL-PRF-38535 Requirements
1.2 Micron Radiation Hardened CMOS
Total Dose Up to 300kRAD(Si)
Latchup Free
EIA RS-422 Compatible Outputs (Except for IOS)
Operation with TTL Based on V
IH
= V
DD
/2
High Impedance Outputs when Disabled or Powered
Down
Low Power Dissipation 2.75mW Standby (Max)
Single 5V Supply
Low Output Impedance 10Ω or Less
Full -55°C to +125°C Military Temperature Range
Applications
Line Transmitter for MIL-STD-1553 Serial Data Bus
Line Transmitter for RS422
Ordering Information
ORDERING
NUMBER
INTERNAL
MKT. NUMBER PART MARKING
TEMP. RANGE
(°C) PACKAGE
PKG.
DWG. #
5962F9563201QEC HS1-26CT31RH-8 Q 5962F95 63201QEC -55 to +125 16 LD SBDIP D16.3
5962F9563201QXC HS9-26CT31RH-8 Q 5962F95 63201QXC -55 to +125 16 LD FLATPACK K16.A
5962F9563201VEC HS1-26CT31RH-Q Q 5962F95 63201VEC -55 to +125 16 LD SBDIP D16.3
5962F9563201VXC HS9-26CT31RH-Q Q 5962F95 63201VXC -55 to +125 16 LD FLATPACK K16.A
HS1-26CT31RH/PROTO HS1-26CT31RH/PROTO HS1 - 26CT31RH/PROTO -55 to +125 16 LD SBDIP D16.3
HS9-26CT31RH/PROTO HS9-26CT31RH/PROTO HS9 - 26CT31RH/PROTO -55 to +125 16 LD FLATPACK K16.A
5962F9563201V9A HS0-26CT31RH-Q -55 to +125
Data Sheet August 25, 2008
[ /Title
(HS-
26C31
RH)
/Subje
ct
(Radia
tion
Harde
ned
Quad
Differe
ntial
Line
Driver)
/Autho
r ()
/Keyw
ords
(Inters
il
Corpo
ration,
semic
onduc
tor,
Radiat
ion
Harde
ned,
RH,
Rad
Hard,
QML,
Satellit
e,
SMD,
Class
V,
Data
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2000, 2008. All Rights Reserved
Satellite Applications Flow (SAF) is a trademark of Intersil Corporation. All other trademarks mentioned are the property of their
2
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN2929.3
August 25, 2008
Pinouts
HS1-26CT31RH (16 LD SBDIP)
CDIP2-T16
TOP VIEW
HS9-26CT31RH (16 LD FLATPACK)
CDFP4-F16
TOP VIEW
Logic Diagram
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
AIN
AO
AO
ENABLE
BO
BO
GND
BIN
VDD
DO
DO
ENABLE
CO
CO
CIN
DIN
AIN
AO
AO
ENABLE
BO
BO
BIN
GND
2
3
4
5
6
7
8
116
15
14
13
12
11
10
9
VDD
DIN
DO
DO
ENABLE
CO
CO
CIN
ENABLE ENABLE
AIN
AO
BIN
BO
CIN
CO
DIN
DO DO CO BO AO
HS-26CT31RH
3
FN2929.3
August 25, 2008
Die Characteristics
DIE DIMENSIONS:
96.5 milx195 milsx21 mils
(2450x4950)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 10kÅ ± 1kÅ
Metallization:
M1: Mo/TiW
Thickness: 5800Å
M2: Al/Si/Cu (Top)
Thickness: 10k
Å ±1kÅ
Substrate:
AVLSI1RA
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
V
DD
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2.0x10
5
A/cm
2
Bond Pad Size:
110µmx100µm
Metallization Mask Layout
HS26CT31RH
(14) DO
(13) DO
(12) ENABLE
(11) CO
(10) CO
AO (2)
AO
(3)
ENABLE (4)
BO
(5)
BO (6)
BIN (7)
GND (8)
CIN (9)
GND (8)
(1) AIN
(16) VDD
(15) DIN
(16) VDD
HS-26CT31RH