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5962F9563002VYC

Part # 5962F9563002VYC
Description Rad-Hard 16 Channel CMOS28 Ld Ceramic Flatpack
Category IC
Availability Out of Stock
Qty 0
Qty Price
1 + $300.00000



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

HS-1840ARH, HS-1840BRH
7
FN4355.3
September 14, 2010
Ceramic Metal Seal Flatpack Packages (Flatpack)
NOTES:
1. Index area: A notch or a pin one identification mark shall be located
adjacent to pin one and shall be located within the shaded area
shown. The manufacturer’s identification shall not be used as a pin
one identification mark. Alternately, a tab (dimension k) may be
used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the limits
of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass over-
run.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension M
applies to lead plating and finish thickness. The maximum limits of
lead dimensions b and c or M shall be measured at the centroid of
the finished lead surfaces, when solder dip or tin plate lead finish is
applied.
5. N is the maximum number of terminal positions.
6. Measure dimension S1 at all four corners.
7. For bottom-brazed lead packages, no organic or polymeric materi-
als shall be molded to the bottom of the package to cover the leads.
8. Dimension Q shall be measured at the point of exit (beyond the me-
niscus) of the lead from the body. Dimension Q minimum shall be
reduced by 0.0015 inch (0.038mm) maximum when solder dip lead
finish is applied.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
-D-
-C-
0.004 H A - B
M
D
S S
-A- -B-
0.036 H A - B
M
D
S S
e
E
A
Q
L
D
A
E1
SEATING AND
LE2
E3 E3
BASE PLANE
-H-
b
C
S1
M
c1
b1
(c)
(b)
SECTION A-A
BASE
LEAD FINISH
METAL
PIN NO. 1
ID AREA
A
M
K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B)
28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.045 0.115 1.14 2.92 -
b 0.015 0.022 0.38 0.56 -
b1 0.015 0.019 0.38 0.48 -
c 0.004 0.009 0.10 0.23 -
c1 0.004 0.006 0.10 0.15 -
D - 0.740 - 18.80 3
E 0.460 0.520 11.68 13.21 -
E1 - 0.550 - 13.97 3
E2 0.180 - 4.57 - -
E3 0.030 - 0.76 - 7
e 0.050 BSC 1.27 BSC -
k 0.008 0.015 0.20 0.38 2
L 0.250 0.370 6.35 9.40 -
Q 0.026 0.045 0.66 1.14 8
S1 0.00 - 0.00 - 6
M - 0.0015 - 0.04 -
N28 28-
Rev. 0 5/18/94
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