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5962-9579801MPA

Part # 5962-9579801MPA
Description MOSFET DRVR 1.5A 1-OUT High Speed Inv/Non-Inv 8-Pin CDIP T
Category IC
Availability Out of Stock
Qty 0
Qty Price
1 + $13.44600



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-9579801M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE Level-NC-NC-NC
5962-9579801MPA ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC
5962-9579801VPA ACTIVE CDIP JG 8 1 TBD A42 Level-NC-NC-NC
UC1705J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC
UC1705J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC
UC1705L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE Level-NC-NC-NC
UC2705D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2705J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC
UC2705N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-NC-NC-NC
UC3705D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3705DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3705DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3705J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC
UC3705N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-NC-NC-NC
UC3705NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-NC-NC-NC
UC3705T ACTIVE TO-220 KC 5 50 Green (RoHS &
no Sb/Br)
CU SN Level-NC-NC-NC
UC3705TG3 ACTIVE TO-220 KC 5 50 Green (RoHS &
no Sb/Br)
CU SN Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
Addendum-Page 1
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
Addendum-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
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