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SP0503BAHTG

Part # SP0503BAHTG
Description ESD Suppressor TVS 20KV 4-Pin(3+Tab) SOT-143 T/R
Category FUSE
Availability Out of Stock
Qty 0
Qty Price
1 + $0.21068



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

72
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Surface Mount TVS Avalanche Diode Array
SP050xBA Lead-Free/Green Series
SP050xBA Lead-Free/Green Series
Description
Features
Applications
The surface mount family of arrays are designed to
suppress ESD and other transient overvoltage events.
These arrays are used to meet the International
Electrotechnical Compatibility (IEC transient immunity
standards IEC 61000-4-2 for Electrostatic Discharge
Requirements). The series are used to help protect
sensitive digital or analog input circuits on data, signal, or
control lines with voltage levels up to 5VDC.
The monolithic silicon arrays are comprised of specially
designed structures for transient voltage suppression(TVS).
The size and shape of these structures have be tailored
for transient protection. The low capacitance and clamp
voltage are ideal for high speed signal line protection.
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equipment (Laptop,
Palmtop computers)
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(USB1.1)
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Pinout
1
2
3
SP0502BAHTG
SP0502BAJTG
RoHS
Pb
GREEN
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small SC70, SOT-23, SOT-143, MSOP or TSSOP packages
t &4%$BQBCJMJUZ4UBOEBSET
- IEC 61000-4-2, Direct Discharge ........ 20kV (Level 4)
- IEC 61000-4-2, Air Discharge .............. 30kV (Level 4)
- MIL STD 883 3015.7 ..........................................30kV
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t 'BTU3FTQPOTF5JNF ..................................................<1ns
t -PX*OQVU$BQBDJUBODF ...................................30pF Typical
t 0QFSBUJOH5FNQFSBUVSF3BOHF..................... -40ºC to 85ºC
1
2
3
4
SP0503BAHTG
1
2
3
4
5
SP0504BAHTG
SP0504BAJTG
1
2
3
4
6
5
SP0505BAHTG
8
76
5
4
321
SP0504BAATG
8
76
5
4
321
SP0506BAATG
SP0505BAJTG
HF
73
©2009 Littelfuse, Inc.
SPA™ Silicon Protection Array Products
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Surface Mount TVS Avalanche Diode Array
SP050xBA Lead-Free/Green Series
Lead-Free/Green SP050xBA
Absolute Maximum Ratings
Parameter Rating Units
Storage Temperature Range -65 to + 150 ºC
Package Power Dissipation
SC70
SOT23-3, SOT23-5, SOT23-6, SOT143
TSSOP, MSOP
0.2
0.225
0.5
W
W
W
Electrical Characteristics T
A
= +25ºC, Unless Otherwise Specified
Parameter Test Conditions Min Typ Max Units
Reverse Standoff Voltage I
R
< = 1μA - - 5.5 V
Reverse Standoff Leakage Current V = 5.0V 1 100 nA
Signal Clamp Voltage
Positive I = 10mA 5.6 6.8 8 V
Negative I = 10mA -1.2 -0.8 -0.4 V
Clamp Voltage during ESD
MIL-STD-883 Method 3015 (HBM) test
+ 8kV 12 V
- 8kV -8 V
ESD Test Level (1)
IEC-61000-2, Contact discharge 20 kV
MIL-STD-883 Method 3015 (HBM) 30 kV
Capacitance 2.5V @ 1Mhz 30 pF
Turn on/off Time <1 ns
Temperature Range
Operating -40 85 ºC
Storage -65 150 ºC
Diode Dynamic Resistance
Forward Conduction 1.0 Ω
Reverse Conduction 1.4 Ω
Note:
(1) ESD voltage applied between channel pins and ground, one pin at a time; all other channel pins are open; all ground pins are grounded.
74
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Surface Mount TVS Avalanche Diode Array
SP050xBA Lead-Free/Green Series
Typical Input VI Characteristics
(Pulse-mode measurements, pulse width = 0.7 mS nominal)
1. 6
1. 4
1. 2
1. 0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
-1.4
-1.6
Input Current (A)
Input Voltage (V)
87654321
0
-1-2-3 9
Typical Diode Capacitance vs. Reverse Voltage
Diode Capacitance (pF)
Diode Reverse Voltage (V)
0
1
2
3
4
5
0
20
40
60
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
5°C/second max
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 250
+0/-5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters - Wave Soldering
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