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Material Content Data Sheet
Sales Product Name TLE4976-1K Issued 28. August 2013
MA# MA000477870
Package PG-SC59-3-4 Weight* 13.90 mg
Construction Element Material Group Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
chip inorganic material silicon 7440-21-3 0.705 5.07 5.07 50688 50688
leadframe inorganic material silicon 7440-21-3 0.001 0.01 75
non noble metal titanium 7440-32-6 0.005 0.04 377
non noble metal chromium 7440-47-3 0.016 0.11 1132
non noble metal copper 7440-50-8 5.224 37.58 37.74 375829 377413
wire noble metal gold 7440-57-5 0.011 0.08 0.08 824 824
encapsulation organic material carbon black 1333-86-4 0.056 0.40 4026
plastics brominated resin - 0.070 0.50 5033
inorganic material antimonytrioxide 1309-64-4 0.140 1.01 10066
plastics epoxy resin - 1.273 9.16 91598
inorganic material silicondioxide 60676-86-0 5.457 39.27 50.34 392561 503284
leadfinish non noble metal tin 7440-31-5 0.258 1.86 1.86 18568 18568
plating noble metal silver 7440-22-4 0.363 2.61 2.61 26142 26142
glue plastics epoxy resin - 0.056 0.40 4039
noble metal silver 7440-22-4 0.265 1.90 2.30 19042 23081
*deviation < 10% Sum in total: 100,00 1000000
Important Remarks:
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company Infineon Technologies AG
Address 81726 München
Internet www.infineon.com
