138
Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666
Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686
Specifications subject specified. Latin/S. Am.: +54 (0) 11-4733-2200 Netherlands: +31 (0) 73-6246-999
www.te.com to change. USA: +1 (800) 522-6752 Germany: +49 (0) 6251-133-1999 China: +86 (0) 400-820-6015
High Speed Backplane Connectors
MULTIGIG RT Connector Products
The MULTIGIG RT product
line is a backplane intercon-
nect family that offers flexi-
bility and customization.
This printed circuit based,
pinless, interconnect family
is comprised of modular
components which can be
used in a variety of combi-
nations. The connectors in
this innovatively flexible
platform can be combined
to provide the density, data
throughput, and signal
integrity required for appli-
cations in today’s computer,
military, medical, or indus-
trial control industries. The
use of printed circuit wafers
in this connector system
allows for cost effective
sequencing and electrical
customization of the con-
nector. Wafers can be man-
ufactured specifically for
differential or signal ended
performance and the
impedance, propagation
delay, and crosstalk of the
connector can be altered
per customer requirements.
This scalable board to
backplane connector family
is a robust, “pinless” design
which eliminates the pin
field on backplane boards
and reduces the end user’s
exposure to field failure in
card cage systems. The
MULTIGIG RT connector
family is designed specifi-
cally for 20.30 [.800] or
25.40 [1.00] card pitch
systems.
■ MULTIGIG RT 1
connector —
141 signals/inch, data
rates up to 3.125 Gb/s
■ MULTIGIG RT 2
connector —
113 signals/inch, data
rates of 3.125 Gb/s to
6.4⫹ Gb/s and has been
demonstrated to support
10 Gb/s
www.multigigrt.com
Product Facts
■ Customizable impedance
matched printed circuit
wafer interface
■ Available for stacking
applications
■ Inverse sex backplane
connector system with
“pinless” interface
■ Superior crosstalk
performance
■ Optimized footprints for
signal integrity and ease of
board design
■ Utilizes a 0.56 [.022]
diameter via for backplane
connector for lower cost
board fabrication
■ Three levels of signal
contact sequencing
■ Available in modular style
■ Available for 20.30 [.800]
or 25.40 [1.00] card pitch
systems
■ Durability rated for 200
cycles
■ Fully compatible with MP
based fiber optic array
interconnects
■ Complete connector family
includes
■ Power Modules = >
Maximize Amps/inch
density, voltages in pairs
■ Guidance Modules
■ Die cast for strength
■ Optional ESD contact
■ Three sequence levels
■ Press fit or hardware
mounted
■ Backplane drill pattern
enabled keying
■ Cable assembly
proposals available
■ MULTIGIG RT connector
products are fully
compatible with 2mm HM
equipment practices
Applications
■ Telecommunications
Equipment
■ Metro Optical Networking
equipment
■ SONET switched platforms
■ Aggregation switches
■ Midrange Servers
■ High End Servers
■ High speed custom platforms
■ Mass data storage
■ Rugged, mission-critical
applications
Technical Documents
Application Specifications
114-13062 Power Modules
114-13056 Signal Connectors
Product Specifications
108-2062 Power Modules
108-2072 Signal Connectors
Qualification Test Reports
501-538 Power Connectors
501-544 Signal Connectors
Engineering Report
502-1130 Power Connectors
Routing Guide RT 2 on te.com
