FCI ELECTRONICS 10067847-001RLF

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Item Description: Conn SD Card HDR 11 POS Solder RA SMD T/R 0.5A/Contact - T

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FCI ELECTRONICS 1023
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Technical Document


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NUMBER
GS-12-497
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
1 of 8 G
AUTHORIZED BY
DATE
SD CARD CONNECTOR
Bill Lin 12/26/09
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
1.0 OBJECTIVE
This specification defines the performance test and quality requirements of SD card
reader connector with push-push type.
2.0 SCOPE
This product specification is applied for SD card reader connector, which provides the
interconnection between PCB to card.
3.0 GENERNAL REQUIREMENTS
3.1 Drawing : 10067847
3.2 Operation and Storage:
3.2.1 Current Rating: 0.5A.
3.2.2 Voltage Rating : 17V
3.2.3 Operating temperature : -40 to 105
3.2.4 Storage temperature: -40 to 105
3.3 Material :
3.3.1
Housing: LCP, GF30, UL94V-0, color: black.
3.3.2
SD Contact: Phosphor Bronze.
3.3.3
WP Contact: Copper Alloy.
3.3.4 CD Contact: Copper Alloy.
3.3.5
Shield : Stainless
3.3.6
Slider Cam: PA9T or LCP
3.3.7 Locking Arm: Stainless
3.3.8 Positioning Pin :Stainless
3.3.9 Spring: SWP-B
3.4 Finish:
3.4.1 SD/CD/WP Contact:(a) Contact area: Au plated (or equivalent palladium nickel)
PDM: Rev:G Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-497
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
2 of 8 G
AUTHORIZED BY
DATE
SD CARD CONNECTOR
Bill Lin 12/26/09
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
(b) Solder area: Mate Tin plated
(c) Under plated: Nickel plated overall.
3.4.2
Shield :
(a) Solder area: Gold flash plated
(b) Under plated: Nickel plated overall
3.5
Commercial Standard Specification
3.5.1
EIA 364 Test methods for electrical connectors
3.5.2 UL-STD-94 Flammability
3.5.3 ASTM B422-90 High strength copper alloy
3.6 FCI Specifications:
3.6.1 BUS-15-002M Nickel Plating
3.6.2 BUS-15-005 Gold Plating
3.6.3 GES-31-002 Workmanship STD & Insp. Instruction
3.6.4 GS-14-1253 Package Specification
4.0 TEST REQUIREMENTS AND PROCEDURES
TEST DESCRIPTION
REQUIREMENTS TEST METHOD & CONDITION
Examination of product Meet requirements of product
drawing
Visual inspection
No physical damage
ELECTRICAL REQUIREMENTS
Contact Resistance 100m Max. 20 mV maximum open circuit
voltage
EIA 364-06
Insulation Resistance 1000M Min.
500V DC. 1 minute,
EIA 364-21
Dielectric Withdrawing Voltage
Resistance
No creeping discharge or
flashes occur
Current leakage 1mA Max.
500V AC rms., 1 minute, test
between adjacent contacts of
unmated sample
EIA-364-20
MECHANICAL REQUIREMENTS
Total ejection and insertion
Force
Total ejection Force: 8N Min.
Total Insertion Force: 12N Max.
EIA 364-13
speed:25 mm/minute
Vibration No physical damage Duration :3 axis, 8 hours per
PDM: Rev:G Released .STATUS: Printed: Nov 28, 2010
NUMBER
GS-12-497
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
3 of 8 G
AUTHORIZED BY
DATE
SD CARD CONNECTOR
Bill Lin 12/26/09
CLASSIFICATION
UNRESTRICTED
Copyright FCI
Form E-3334
Rev F
GS-01-001
Discontinuity:1u sec. max. spatial axis
Frequency:10-1000 Hz – 0.35mm
amplitude
Acceleration :2G
Sweep rate : 1 octave/min.
Shock No physical damage
Discontinuity:1u sec. max.
Shock acceleration 50G
Duration of individual shock=6 ms,
half-wave sinusoidal
No of shocks : 50 shocks per
spatial axis
Contact Force 0.2N~0.4N.
Wrestling (Flapping) Strength No physical damage Applied force 10N to SD card for
Front direction. (The card should
be inserted 15mm into the
connector from the head of card)
Durability cycling No physical damage.
Push-push function must be
workable.
Operation Cycles: 12,000 cycles,
(500 cycles at
-40 ; 10500
cycles at 23 ; 1000 cycles at
85 ).
Mated and unmated
connector with cycles time about
45sec/cycle, see Figure 3.
ENVIRONMENTAL REQUIREMENTS
Humidity heat cycles No physical damage Number of cycles: 6
Relative humidity : 90~100 %
Cycle period : 24 hours
See FIG 2.
Dust test No physical damage With SD CARD mated.
Begin dust concentration of 300
g/cm*cm*cm of chamber volume,
flow rate =300 m/s and exposure
time of 1 hr.
High temperature operation No physical damage The test samples shall be soaked
at 70c for 2 hours,unpowered
Low temperature operation No physical damage The test samples shall be soaked
at -30c for 2 hours,unpowered
Salt Spray No harmful corrosion
Temperature: 35 ±2
Concentration: 5%
Period : 48 hours
EIA 364-26
Temperature shock test No physical damage Number of cycles: 100
Test cycle:
Temp at start of test: room temp;
Acclimatization period to 70c:
<=10s
PDM: Rev:G Released .STATUS: Printed: Nov 28, 2010
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