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Material Content Data Sheet
Sales Product Name BSC050N03MS G Issued 5. February 2015
MA# MA001321710
Package PG-TDSON-8-5 Weight* 118.95 mg
Construction Element Material Group Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
chip inorganic material silicon 7440-21-3 1.213 1.02 1.02 10194 10194
leadframe non noble metal iron 7439-89-6 0.038 0.03 318
inorganic material phosphorus 7723-14-0 0.011 0.01 95
non noble metal copper 7440-50-8 37.762 31.74 31.78 317470 317883
wire non noble metal copper 7440-50-8 0.059 0.05 0.05 494 494
encapsulation organic material carbon black 1333-86-4 0.086 0.07 726
plastics epoxy resin - 6.132 5.16 51552
inorganic material silicondioxide 60676-86-0 36.964 31.08 36.31 310764 363042
leadfinish non noble metal tin 7440-31-5 1.452 1.22 1.22 12204 12204
plating noble metal silver 7440-22-4 0.166 0.14 0.14 1392 1392
solder noble metal silver 7440-22-4 0.035 0.03 296
non noble metal tin 7440-31-5 0.028 0.02 237
non noble metal lead 7439-92-1 1.345 1.13 1.18 11310 11843
heatspreader non noble metal iron 7439-89-6 0.011 0.01 95
inorganic material phosphorus 7723-14-0 0.003 0.00 29
non noble metal copper 7440-50-8 11.320 9.52 9.53 95170 95294
heat sink CLIP non noble metal iron 7439-89-6 0.022 0.02 188
inorganic material phosphorus 7723-14-0 0.007 0.01 56
non noble metal copper 7440-50-8 22.292 18.74 18.77 187410 187654
*deviation < 10% Sum in total: 100.00 1000000
Important Remarks:
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company Infineon Technologies AG
Address 81726 München
Internet www.infineon.com