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Material Content Data Sheet
Sales Product Name BSC030P03NS3 G Issued 5. February 2015
MA# MA001321030
Package PG-TDSON-8-1 Weight* 122.79 mg
Construction Element Material Group Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
chip inorganic material silicon 7440-21-3 5.418 4.41 4.41 44120 44120
leadframe non noble metal iron 7439-89-6 0.038 0.03 308
inorganic material phosphorus 7723-14-0 0.011 0.01 92
non noble metal copper 7440-50-8 37.762 30.76 30.80 307521 307921
wire non noble metal copper 7440-50-8 0.023 0.02 0.02 185 185
encapsulation organic material carbon black 1333-86-4 0.078 0.06 634
plastics epoxy resin - 5.528 4.50 45019
inorganic material silicondioxide 60676-86-0 33.324 27.14 31.70 271384 317037
leadfinish non noble metal tin 7440-31-5 1.452 1.18 1.18 11822 11822
plating noble metal silver 7440-22-4 0.166 0.13 0.13 1348 1348
solder noble metal silver 7440-22-4 0.101 0.08 825
non noble metal tin 7440-31-5 0.081 0.07 660
non noble metal lead 7439-92-1 3.868 3.15 3.30 31500 32985
CLIP plating noble metal silver 7440-22-4 1.289 1.05 1.05 10501 10501
heatspreader non noble metal iron 7439-89-6 0.011 0.01 92
inorganic material phosphorus 7723-14-0 0.003 0.00 28
non noble metal copper 7440-50-8 11.320 9.22 9.23 92187 92307
heat sink CLIP non noble metal iron 7439-89-6 0.022 0.02 182
inorganic material phosphorus 7723-14-0 0.007 0.01 55
non noble metal copper 7440-50-8 22.292 18.15 18.18 181537 181774
*deviation < 10% Sum in total: 100.00 1000000
Important Remarks:
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company Infineon Technologies AG
Address 81726 München
Internet www.infineon.com
