Multilayer Ceramic Capacitors ( )
High
Capacitance
Resistance
to Solder
Heat
Temperature
Cycle
Damp Heat
(steady
state)
Appearance:no mechanical damage
Capacitance change:
Temp. Char. B, X7R, X5R: within ±7.5 %
F, Y5V: within ±20 %
tand initial value
IR:initial value
With-stand voltage:no dielectric breakdown or damage
Solder bath method
Preconditioning:
Heat treatment (150ûC, 1h)
Solder temperature:270±5ûC
Dipping period:3.0±0.5 s
Preheat condition:
Temp.
TypeÒ10Ó,Ò11Ó,Ò12Ó
TypeÒ13Ó,Ò23Ó
1
80 to 100 ûC
120 to 180s 300 to 360s
150 to 200 ûC
120 to 180s 300 to 360s
Recovery(Standard condition):48 ± 4h
Appearance:no mechanical damage
Capacitance change:
Temp. Char. B, X7R, X5R: within ±7.5 %
F, Y5V: within ±20 %
tand initial value
IR:initial value
With-stand voltage: no dielectric breakdown or damage
Preconditioning:
Heat treatment (150ûC,1h)
Step 1:
Minimum operation temp. 30±3 min.
Step 2:Room temp. 3 min.
Step 3:
Maximum operation temp. 30±3 min.
Step 4:Room temp. 3 min.
Number of cycles:5 cycles
Recovery(Standard condition):48 ± 4h
Preconditioning:
Heat treatment
(150ûC,1h)
Temperature:40±2ûC
Relative humidity:90 to 95 %
Test period:500+24/0 h
Recovery(Standard condition):48 ± 4h
Test MethodItem Specification
Appearance:no mechanical damage
Capacitance change:
Temp. Char. B, X7R, X5R: within ±12.5 %
F, Y5V: within ±30 %
Note:ECJ0EB0J1051(0402/X5R/6.3V/1.0µF)
ECJ1VB0J4751(0603/X5R/6.3V/4.7µF)
ECJ1VB0G106M(0603/X5R/4V/10µF)
within ±20 %
tand 0.3 max.
Please confirmation to the technical reports for details.
IR:50/C (MW) min.
Note:DC10V, DC6.3V;10/C (MW)min.(C:Nominal cap. in µF)
Note 1) Heat treatment:1 h of heat treatment at 150+0/Ð10ûC followed by 48±4 h recovery under the standead condition.
Note 2) Voltage treatment:1 h of voltage treatment under the specified temperature and voltage for testing followed by 48 ±4 h of recovery under
the standead condition.
Loading
Under
Damp
Heat
Loading at
High
Temperature
Appearance:no mechanical damage
Capacitance change:
Temp. Char. B, X7R, X5R: within ±12.5 %
F, Y5V: within ±30 %
Note:ECJ0EB0J1051(0402/X5R/6.3V/1.0µF)
ECJ1VB0J4751(0603/X5R/6.3V/4.7µF)
ECJ1VB0G106M(0603/X5R/4V/10µF)
within ±20 %
tand 0.3 max.
Please confirmation to the technical reports for details.
IR:25/C (MW) min.
Note:DC10V, DC6.3V;5/C (MW)min.(C:Nominal cap. in µF)
Preconditioning:
Voltage treatment
Temperature:40±2ûC
Relative humidity:90 to 95 %
Applied voltage:Rated voltage
Test period:500+24/0 h
Recovery(Standard condition):48 ± 4h
Preconditioning:
Voltage treatment
Temperature:
Maximum operation temp. ±3ûC
Applied voltage:1Rated voltage´200%
2Rated voltage´150%
3Rated voltage´100%
Please confirmation to the technical
reports for details.
Charge/discharge current: within 50mA
Test period:1000+48/0 h
Recovery(Standard condition):48 ± 4h
Appearance:no mechanical damage
Capacitance change:
Temp. Char. B, X7R, X5R: within ±12.5 %
F, Y5V: within ±30 %
Note:ECJ0EB0J1051(0402/X5R/6.3V/1.0µF)
ECJ1VB0J4751(0603/X5R/6.3V/4.7µF)
ECJ1VB0G106M(0603/X5R/4V/10µF)
within ±20 %
tand 0.3 max.
Please confirmation to the technical reports for details.
IR:50/C (MW) min.
Note:DC10V, DC6.3V;10/C (MW)min.(C:Nominal cap. in µF)
October 2005