Data Sheet ADP2164
Rev. 0 | Page 19 of 20
OUTLINE DIMENSIONS
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGC.
042709-A
1
0.65
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
0.50
0.40
0.30
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
2.60
2.50 SQ
2.40
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 48. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-26)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Output Voltage Package Description Package Option
ADP2164ACPZ-R7 −40°C to +125°C Adjustable 16-Lead LFCSP_WQ CP-16-26
ADP2164ACPZ-1.0-R7 −40°C to +125°C 1.0 V 16-Lead LFCSP_WQ CP-16-26
ADP2164ACPZ-1.2-R7 −40°C to +125°C 1.2 V 16-Lead LFCSP_WQ CP-16-26
ADP2164ACPZ-1.5-R7 −40°C to +125°C 1.5 V 16-Lead LFCSP_WQ CP-16-26
ADP2164ACPZ-1.8-R7 −40°C to +125°C 1.8 V 16-Lead LFCSP_WQ CP-16-26
ADP2164ACPZ-2.5-R7 −40°C to +125°C 2.5 V 16-Lead LFCSP_WQ CP-16-26
ADP2164ACPZ-3.3-R7 −40°C to +125°C 3.3 V 16-Lead LFCSP_WQ CP-16-26
ADP2164-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
