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C3225X5R0J107M

Part # C3225X5R0J107M
Description Cap Ceramic 100uF 6.3V X5R 20% SMD 1210 85C Plastic T/R
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Technical Document


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ADP2164 Data Sheet
Rev. 0 | Page 4 of 20
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
INTEGRATED SOFT START
Soft Start Time All switching frequencies 2048
Clock
cycles
EN PIN
EN Input Rising Threshold 1.12 1.2 1.28 V
EN Input Hysteresis 100 mV
EN Pull-Down Resistor 1
THERMAL SHUTDOWN
Thermal Shutdown Threshold T
J
increasing 140 °C
Thermal Shutdown Hysteresis 15
°C
1
Pin-to-pin measurements.
2
Guaranteed by design.
Data Sheet ADP2164
Rev. 0 | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
PVIN, VIN, SW −0.3 V to +7 V
FB, SYNC, TRK, RT, EN, PGOOD −0.3 V to +7 V
PGND to GND −0.3 V to +0.3 V
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is measured using natural convection on a JEDEC 4-layer
board. The exposed pad is soldered to the printed circuit board
with thermal vias.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
16-Lead LFCSP 38.3 °C/W
ESD CAUTION
ADP2164 Data Sheet
Rev. 0 | Page 6 of 20
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
09944-003
12
11
10
1
3
4
PVIN
NOTES
1. THE EXPOSED PAD SHOULD BE SOLDERED
TO AN EXTERNAL GROUND PLANE UNDER
THE IC FOR THERMAL DISSIPATION.
SW
SW
9
SW
S
YNC
TRK
2
RT
FB
6
PGN
D
5
GND
7
PGND
8
P
GND
16
PGOO
D
15
EN
14
VIN
13
PVIN
ADP2164
TOP VIEW
(Not to Scale)
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1 SYNC
Synchronization Input. To synchronize the switching frequency to an external clock, connect this pin to an
external clock with a frequency of 500 kHz to 1.4 MHz (see the Oscillator and Synchronization section for
more information).
2 RT
Frequency Setting. To select a switching frequency of 600 kHz, connect this pin to GND; to select a switching
frequency of 1.2 MHz, connect this pin to VIN. To program the frequency from 500 kHz to 1.4 MHz, connect a
resistor from this pin to GND (see the Oscillator and Synchronization section for more information).
3 TRK
Tracking Input. To track a master voltage, connect the TRK pin to a voltage divider from the master voltage. If
the tracking function is not used, connect the TRK pin to VIN. For more information, see the Voltage Tracking
section.
4 FB
Feedback Voltage Sense Input. Connect this pin to a resistor divider from V
OUT
. For the preset output version,
connect this pin directly to V
OUT
.
5 GND Analog Ground. Connect to the ground plane.
6, 7, 8 PGND Power Ground. Connect to the ground plane and to the output return side of the output capacitor.
9, 10, 11 SW Switch Node Output. Connect to the output inductor.
12, 13 PVIN
Power Input Pin. Connect this pin to the input power source. Connect a bypass capacitor between this pin
and PGND.
14 VIN
Bias Voltage Input Pin. Connect a bypass capacitor between this pin and GND; connect a small (10 Ω) resistor
between this pin and PVIN.
15 EN
Precision Enable Pin. The external resistor divider can be used to set the turn-on threshold. To enable the
part automatically, connect the EN pin to VIN. This pin has a 1 MΩ pull-down resistor to GND.
16 PGOOD Power-Good Output (Open Drain). Connect this pin to a resistor from any pull-up voltage lower than 6.5 V.
17 (EPAD) Exposed Pad The exposed pad should be soldered to an external ground plane under the IC for thermal dissipation.
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