AVX 12061C104KAT2A

Cross Number:

Item Description: CAP 0.1UF 100VDC X7R 10% SMD1206 - Tape and Reel

Qty Price
1 + $0.01000






Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

17
X7R Dielectric
General Specifications
X7R formulations are called “temperature stable” ceramics and
fall into EIA Class II materials. X7R is the most popular of these
intermediate dielectric constant materials. Its temperature varia-
tion of capacitance is within ±15% from -55°C to +125°C. This
capacitance change is non-linear.
Capacitance for X7R varies under the influence of electrical op-
erating conditions such as voltage and frequency.
X7R dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capacitance
due to applied voltages are acceptable.
PART NUMBER (see page 2 for complete part number explanation)
% Cap Change
10
-60 -40
-20 0 20 40 60 80
100
120
140
Temperature °C
X7R Dielectric�
Typical Temperature Coefficient
5
0
-5
-10
-15
-20
-25
% Capacitance
+10
+20
+30
0
-10
-20
-30
1KHz
10 KHz 100 KHz 1 MHz 10 MHz
Frequency
Capacitance vs. Frequency
Insulation Resistance (Ohm-Farads)
1,000
10,000
100
0
0
20
120
40 60 80
Temperature °C
Insulation Resistance vs Temperature
100
Impedance,
10
100 1000
Frequency, MHz
Variation of Impedance with Cap Value�
Impedance vs. Frequency�
1,000 pF vs. 10,000 pF - X7R�
0805�
0.10
0.01
1.00
1,000 pF
10,000 pF
10.00
Impedance,
110
100 1,000
Frequency, MHz
Variation of Impedance with Chip Size�
Impedance vs. Frequency�
100,000 pF - X7R�
0.1
.01
1.0
1206
0805
10
1210
Impedance,
110
100 1,000
Frequency, MHz
Variation of Impedance with Chip Size�
Impedance vs. Frequency�
10,000 pF - X7R�
0.1
.01
1.0
1206
0805
10
1210
0805
Size
(L" x W")
5
Voltage
4V = 4
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
C
Dielectric
X7R = C
103
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
M
Capacitance
Tolerance
J = ± 5%*
K = ±10%
M = ± 20%
*≤1μF only,
contact factory for
additional values
2
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
Contact
Factory For
Multiples
A
Special
Code
A = Std.
Product
T
Terminations
T = Plated Ni
and Sn
7 = Gold Plated*
Z= FLEXITERM
®
**
A
Failure
Rate
A = Not
Applicable
*Optional termination
**See FLEXITERM
®
X7R section
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
18
X7R Dielectric
Specifications and Test Methods
Parameter/Test X7R Specification Limits Measuring Conditions
Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber
Capacitance Within specified tolerance
≤ 2.5% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10%
Dissipation Factor
≤ 3.0% for 25V DC rating Voltage: 1.0Vrms ± .2V
≤ 3.5% for 25V and 16V DC rating
≤ 5.0% for ≤ 10V DC rating
Insulation Resistance
100,000MΩ or 1000MΩ - μF, Charge device with rated voltage for
whichever is less 120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Note: Charge device with 150% of rated
voltage for 500V devices.
Appearance No defects Deflection: 2mm
Capacitance Test Time: 30 seconds
Resistance to Variation
≤ ±12%
Flexure Dissipation
Meets Initial Values (As Above)
Stresses Factor
Insulation
≥ Initial Value x 0.3
Resistance
Solderability
≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC
with fresh solder for 5.0 ± 0.5 seconds
Appearance No defects, <25% leaching of either end terminal
Capacitance
Variation
≤ ±7.5%
Dip device in eutectic solder at 260ºC for 60
Dissipation
Meets Initial Values (As Above)
seconds. Store at room temperature for 24 ± 2
Resistance to
Factor
hours before measuring electrical properties.
Solder Heat
Insulation
Meets Initial Values (As Above)
Resistance
Dielectric
Meets Initial Values (As Above)
Strength
Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes
Capacitance
Variation
≤ ±7.5% Step 2: Room Temp ≤ 3 minutes
Dissipation
Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes
Thermal
Factor
Shock
Insulation
Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes
Resistance
Dielectric
Meets Initial Values (As Above)
Repeat for 5 cycles and measure after
Strength 24 ± 2 hours at room temperature
Appearance No visual defects
Capacitance
Variation
≤ ±12.5%
Dissipation
≤ Initial Value x 2.0 (See Above)
Load Life Factor
Insulation
≥ Initial Value x 0.3 (See Above)
Resistance
Dielectric
Meets Initial Values (As Above)
Strength
Appearance No visual defects
Capacitance
Variation
≤ ±12.5%
Load Dissipation
≤ Initial Value x 2.0 (See Above)
Humidity Factor
Insulation
≥ Initial Value x 0.3 (See Above)
Resistance
Dielectric
Meets Initial Values (As Above)
Strength
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
1mm/sec
90 mm
19
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE 0101 0201 0402 0603 0805 1206
Soldering Reflow Only Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
Packaging
Paper/Embossed
All Paper All Paper All Paper Paper/Embossed Paper/Embossed
(L) Length
mm 0.40 ± 0.02 0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(in.) (0.016 ± 0.0008) (0.024 ± 0.001) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
(W) Width
mm 0.20 ± 0.02 0.30 ± 0.03 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
(in.) (0.008 ± 0.0008) (0.011 ± 0.001) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
(t) Terminal
mm 0.20 ± 0.02 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(in.) (0.008 ± 0.0008) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 10 10 16 25 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
Cap 100 A A A A
(pF) 150 A A A A
220 A A A A C
330 A AAA C GGG JJJJJJ K
470 A AA C GGG JJJJJJ K
680 A AA C GGG JJJJJJ K
1000 A A A C G G G J J JJJJ K
1500 A C G G J J JJJJ JJJJJJM
2200 A C G G J J JJJJ JJJJJJM
3300 A C C G G J J JJJJ JJJJJJM
4700 A C C G G J J JJJJ JJJJJJM
6800 A C C G G J J JJJJ JJJJJJP
Cap 0.010 A C C G G J J JJJJ JJJJJJP
(μF 0.015 C G G J J JJJJ JJJJJM
0.022 C C G G J J J J J N J J J J J M
0.033 C C G G J J J J N J J J J J M
0.047 C C G G G J J J J N J J J J J M
0.068 C C G G G J J J J N J J J J J P
0.10 C C G G G G J J J J N J J J J M P
0.15 G G J J J N N J J J J Q
0.22 G G J* J J N N N J J J J Q
0.33 NNNNN J JMPQ
0.47 J* NNNNN MMMPQ
0.68 NNN MMQQQ
1.0 J*J* NNNN MMQQQ
1.5 PQQ
2.2 J* P* Q Q Q Q*
3.3
4.7 P* P* Q* Q* Q* Q*
10 P* P* Q* Q* Q*
22 Q* Q*
47
100
WVDC 10 10 16 25 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
SIZE 0101 0201 0402 0603 0805 1206
Letter ACEGJKMNPQXYZ
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
*Optional Specifications – Contact factory
12NEXT

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