Cautions and warnings

Do not exceed the upper category temperature (UCT).

Do not apply any mechanical stress to the capacitor terminals.

Avoid any compressive, tensile or flexural stress.

Do not move the capacitor after it has been soldered to the PC board.

Do not pick up the PC board by the soldered capacitor.

Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified

lead spacing.

Do not exceed the specified time or temperature limits during soldering.

Avoid external energy inputs, such as fire or electricity.

Avoid overload of the capacitors.

The table below summarizes the safety instructions that must always be observed. A detailed de-

scription can be found in the relevant sections of the chapters "General technical information" and

"Mounting guidelines".

Topic Safety information Reference chapter

"General technical

information"

Storage conditions Make sure that capacitors are stored within the

specified range of time, temperature and humidity

conditions.

4.5

"Storage conditions"

Flammability Avoid external energy, such as fire or electricity

(passive flammability), avoid overload of the

capacitors (active flammability) and consider the

flammability of materials.

5.3

"Flammability"

Resistance to

vibration

Do not exceed the tested ability to withstand

vibration. The capacitors are tested to

IEC 60068-2-6.

EPCOS offers film capacitors specially designed

for operation under more severe vibration regimes

such as those found in automotive applications.

Consult our catalog "Film Capacitors for

Automotive Electronics".

5.2

"Resistance to vibration"

B32520 ... B32529

General purpose (stacked/wound)

Page 40 of 45Please read Important notes

at the end of this document.

Topic

Safety information Reference chapter

"Mounting guidelines"

Soldering Do not exceed the specified time or temperature

limits during soldering.

1 "Soldering"

Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning"

Embedding of

capacitors in

finished assemblies

When embedding finished circuit assemblies in

plastic resins, chemical and thermal influences

must be taken into account.

Caution: Consult us first, if you also wish to

embed other uncoated component types!

3 "Embedding of

capacitors in finished

assemblies"

B32520 ... B32529

General purpose (stacked/wound)

Page 41 of 45Please read Important notes

at the end of this document.

Symbols and terms

Symbol English German

α Heat transfer coefficient Wärmeübergangszahl

Temperature coefficient of capacitance Temperaturkoeffizient der Kapazität

A Capacitor surface area Kondensatoroberfläche

Humidity coefficient of capacitance Feuchtekoeffizient der Kapazität

C Capacitance Kapazität

Rated capacitance Nennkapazität

∆C Absolute capacitance change Absolute Kapazitätsänderung

∆C/C Relative capacitance change (relative

deviation of actual value)

Relative Kapazitätsänderung (relative

Abweichung vom Ist-Wert)

∆C/C

Capacitance tolerance (relative deviation

from rated capacitance)

Kapazitätstoleranz (relative Abweichung

vom Nennwert)

dt Time differential Differentielle Zeit

∆t Time interval Zeitintervall

∆T Absolute temperature change

(self-heating)

Absolute Temperaturänderung

(Selbsterwärmung)

∆tan δ Absolute change of dissipation factor Absolute Änderung des Verlustfaktors

∆V Absolute voltage change Absolute Spannungsänderung

dV/dt Time differential of voltage function (rate

of voltage rise)

Differentielle Spannungsänderung

(Spannungsflankensteilheit)

∆V/∆t Voltage change per time interval Spannungsänderung pro Zeitintervall

E Activation energy for diffusion Aktivierungsenergie zur Diffusion

ESL Self-inductance Eigeninduktivität

ESR Equivalent series resistance Ersatz-Serienwiderstand

f Frequency Frequenz

Frequency limit for reducing permissible

AC voltage due to thermal limits

Grenzfrequenz für thermisch bedingte

Reduzierung der zulässigen

Wechselspannung

Frequency limit for reducing permissible

AC voltage due to current limit

Grenzfrequenz für strombedingte

Reduzierung der zulässigen

Wechselspannung

Resonant frequency Resonanzfrequenz

Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur

Diffusion

Derating factor Deratingfaktor

i Current (peak) Stromspitze

Category current (max. continuous

current)

Kategoriestrom (max. Dauerstrom)

B32520 ... B32529

General purpose (stacked/wound)

Page 42 of 45Please read Important notes

at the end of this document.

Part #	B32520C1104J189
Description	CAP FILM 0.1UF 5% 100VDC RADIAL Additional Information:
Category	CAPACITOR
Availability	Out of Stock
Qty	0

B32520C1104J189

Related Items

Technical Document